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We can place advanced components and have the ability to handle BGA assembly including BGA X-ray. STL's capabilities and knowledge to place, solder and inspect advanced SMD’s include:
| *BGA’s (BGA placement up to 55mm² 1.0mm pitch) |
| *µBGA (0.5mm pitch) |
| *QFN/MLP |
| *CSP |
| *Odd Form components |
| *Ultrafine pitch components (0.4mm pitch) |
| *LGA |
| *01005 chip components |
*Large Connectors (up to 72mm diag.) Throughout the process we monitor the quality of your assembly with such tools as 2-½D paste inspection, BGA X-ray inspection, BGA microscope inspection (to monitor BGA soldering quality) and AOI inspection.
BGA mounting technology allows parts to be assembled on the PCB, which could not be mounted using another technology due to their size or complicated pin-out.
The most common IC methods are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), QFJ (Quad Flat J-leaded package) and BGA (Ball Grid Array). There is a significant difference between BGA and QFP technology, as at BGA the outputs of the components placed the bottom of the part.
The main disadvantage of the BGA technology is the fact that analyzing the faults and repairing them has become more complicated as the soldering point are hidden and can only be inspected using x-ray tests.
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